Вы здесь

Funct. Mater. 2019; 26 (2): 436-440.

doi:https://doi.org/10.15407/fm26.02.436

Comparative study of different infrared thermal wave imaging techniques for defect detection of composite materials

Chunjiang Shuai

School of Physical and Telecommunication Engineering, Shaanxi University of Technology, Hanzhong, Shaanxi 723001, China

Abstract: 

In this paper, the basic principles of pulse infrared thermal wave imaging technology and phase-locked infrared thermal wave imaging technology in the defect detection of composite materials were briefly introduced. Then, the defect detection of Carbon Fiber Reinforced Plastics (CFRP) laminates was carried out by using pulse infrared nondestructive testing system and phase-locked infrared nondestructive testing system. The results showed that both methods could detect the defect inside the laminates, but the phrase image of phase-locked testing technology was clearer and more detailed. Pulse infrared nondestructive testing was more suitable for rapid detection of defects in composite materials with high temperature resistant surface, while phase-locked infrared nondestructive testing technology was more suitable for the composite materials whose surface can not withstand high-power illumination.

Keywords: 
pulse infrared thermal imaging, phase-locked infrared thermal imaging, composite materials, defect detection.
References: 

1. M. Pawlak, M. Streza, C. Morari et al., Meas. Sci. Technol., 28, 025008 (2017). https://doi.org/10.1088/1361-6501/aa4f69

2. H. Cai, X. Dong, M. Zhu, Z. Huang, Int. Conf. Opt. Instrum. Tech.: Optoelectr. Imaging/spectrosc. Signal Proc. Tech. (2018).

3. B. Feng, Z. L. Shi, Z. Chang et al., Infrared Phys. Techn., 85, S1350449516306533 (2017). https://doi.org/10.1016/j.infrared.2017.05.020

4. V. Arora, R. Mulaveesala, P. Bison, J. Nondestruct. Eval., 35, 1, (2016). https://doi.org/10.1007/s10921-015-0333-5

5. S. Ranjit, W. Kim, Infrared Phys. Techn., 92 (2018).

6. R. Yang, Y. He, A. Mandelis et al., IEEE T. Ind. Inform., 1( 2018).

7. R. Shrestha, W. Kim, Infrared Phys. Techn., 83, 124 (2017). https://doi.org/10.1016/j.infrared.2017.04.016

8. K. Murali, D. V. R. K. Reddy, R. Mulaveesala, Mater. Today Proc., 5, 544, (2018). https://doi.org/10.1016/j.matpr.2017.11.116

9. R. Mulaveesala, V. Arora, Quant. Infr. Therm. J., 14, 1 (2016). https://doi.org/10.1080/17686733.2016.1229329

10. C. Li, H. Jiang, Int. Conf. Electr. Packaging Tech. (2016).

11. V. Arora, R. Mulaveesala, P. Bison, J. Nondestruct. Eval., 35, 1 (2016). https://doi.org/10.1007/s10921-015-0333-5

12. H. N. Zhang, Z. W. Zhang, Y. Lei, et al., Selected Papers of the Photoelectronic Technology Committee Conferences Held November (2016).

13. K. Murali, D. V. R. K. Reddy, R. Mulaveesala, Mater. Today Proc., 5, 544, (2018). https://doi.org/10.1016/j.matpr.2017.11.116

14. D. Roy, S. Tuli, IEEE T. Instrum. Meas., 26, 2688 (2017)

.

Current number: